Water soluble fluxes use specially formulated water-soluble resins and organic activators that provide excellent cleaning performance, superior solder wettability, and consistent solder joint formation. During soldering, the active flux system breaks down oxide layers and improves the bonding between the solder alloy and the base metal, ensuring strong and reliable metallurgical connections.
HIFLO water soluble flux technology offers water-based formulations that help reduce VOC emissions and support environmentally responsible manufacturing processes. The residues generated after soldering are water-soluble and can be completely removed through controlled post-solder aqueous cleaning processes, preventing corrosion, electrical leakage, and long-term reliability issues in electronic assemblies.
Liquid flux – Water-Soluble Liquid Flux Technology is a highly active soldering flux solution designed for demanding soldering applications where superior oxide removal, excellent solderability, and post-soldering water cleaning are required. .High-activity liquid flux designed for wave soldering, selective soldering, and automated PCB assembly applications
Flux-Cored Solder Wire – Water Soluble Flux-Cored Solder Wire is designed to deliver exceptional soldering performance for modern electronics manufacturing and PCB assembly. The solder wire features a hollow core filled with a specially formulated, high-activity water soluble flux that is released during the soldering process. This active flux effectively removes oxides and surface contaminants, ensuring superior solder wettability, faster solder flow, and the formation of strong, reliable solder joints.
HIFLO Flux-Cored Solder Wire combines high-quality solder alloys with optimized water soluble flux chemistry to deliver consistent soldering performance. The flux core is precisely controlled to ensure uniform flux distribution throughout the wire, providing excellent solderability with minimal interruptions during manual and automated soldering operations.
Flux in solder paste – Water Soluble Solder Paste technology is engineered with high-activity flux formulations that provide excellent printability, stable viscosity control, superior component wetting, and consistent solder joint quality. The flux system enables smooth solder paste deposition through stencil printing while maintaining excellent release characteristics and dimensional accuracy for fine-pitch SMT components.
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