Bonding Applications (Bar) – Wave Soldering Application
Solder Bar (Leaded/Lead-free)
Our Solder Bars are casted from high purity raw materials through an advanced melting process to remove dissolved oxides in the solder alloy, providing higher soldering performance and fewer dross characteristics. Our solder bar composition meets IPC and customer specification standards in the industry.
Benefits:
- High Purity Alloy
- Less Dross
- Fast Wetting and Spreading
- Strong Joints
- Excellent Strength
- Good Solderability
- Deep Penetration