Solder Paste is a highly reliable metal alloy designed to act as an adhesive during soldering processes. When heated to its melting point, the components of the solder paste becomes molten and mixed, creating a strong intermetallic bond between electronic components and circuit boards. Its exceptional strength properties enable it to withstand the heat of soldering without becoming brittle, ensuring the integrity of the soldered joints even under demanding conditions.
One of the key advantages of using Hiflo’s Solder Paste is its longevity. Unlike other adhesives that may dry out over time, our solder paste remains consistently effective, providing extended shelf life and usability. Additionally, the solder paste effectively removes dirt and residue from the surfaces being soldered, promoting a robust and reliable bond. Acting as a flux agent, it enhances the bonding process during soldering, increasing conductivity and efficiency in the soldered connections.
We offer solder paste types 4, 5 & 6, optimized for medium-pitch applications, ensuring precise and consistent soldering results. For micro-pitch requirements, we have specialized solutions available, tailored to meet the most demanding soldering needs in electronics manufacturing. Our solder paste are carefully formulated to provide excellent wetting properties and consistent flow during the soldering process, delivering exceptional results in various applications.
Tacky Cream – Tacky Cream, also known as sticky flux, has a thicker consistency compared to liquid flux. It has a sticky or gel-like texture that helps it adhere to the surfaces being soldered, preventing it from running or dripping. Tacky Cream is often used in situations where there is a need for the flux to stay in place during the soldering process, such as when soldering BGA, vertical or overhead joints.